Solder flux binder produced in the first melting of tin and lead in accordance with PN EN 29453:2000, in a continuous casting process without air, then extruded, which ensures the elimination of the occurrence of oxides. The binder is 1.0 mm thick and weighs 100 g, with a tin content in the product of: 59.5% to 60.5%, and a melting temperature in the range: 183°C to 190°C. SW26 flux is made on the basis of rosin and an organic halogen activator, which is "tethered" in the rosin after soldering, so that it does not come into direct contact with the solder and does not cause corrosion, and also facilitates melting and increases the fluidity of the solder. Solder binder is mainly used in the electronics industry, for the production of standard electronic devices and components, electrical engineering.  Solder binder is mainly used in the electronics industry, for the production of standard electronic devices and components, electrical engineering.

The binder cannot be used in equipment not covered by the exemptions from the restriction contained in Directive 2011/65/EU of the European Parliament and of the Council of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS), as amended.